This 24-layer high-frequency PCB is engineered specifically for the telecommunications industry, delivering exceptional signal integrity and long-term reliability. Built using premium materials such as ISOLA 370HR and Panasonic’s advanced MENTRON6 (M4/M6), this PCB ensures optimal performance in high-speed data transmission environments. With a thickness of 1.6mm (±0.16mm), 1 oz outer copper, and 0.5 oz inner copper, it supports tight design tolerances including 3mil line width and spacing, 20mil BGA pad pitch, and filled vias protected by solder mask. The precision 5μ” ENIG surface finish—including edge plating—offers superior solderability and durability. Impedance control is strictly maintained at 50 ohms single-ended and 100 ohms differential pairs, critical for 5G and RF applications. Rigorous AOI testing eliminates defects like shorts, opens, and scratches, ensuring consistent quality. Trusted by customers across the US, Europe, and Japan, our PCBs combine cutting-edge materials, precise manufacturing, and global compliance standards—ideal for demanding telecom and high-frequency electronics projects.
1. Utilizes high-performance Panasonic MENTRON6 and ISOLA 370HR materials for excellent dielectric stability and low loss at high frequencies.
2. Features 5μ” ENIG finish with edge plating for superior solder joint reliability and long-term durability.
3. Supports ultra-fine traces (3mil) and tight BGA pitches (20mil) with filled vias—ideal for compact, high-density designs.
4. Strict impedance control (50Ω/100Ω) ensures signal integrity in high-speed telecom systems.
5. Fully AOI-tested to eliminate defects, guaranteeing zero-defect delivery for mission-critical applications.
Ideal for 5G base stations, microwave modules, radar systems, high-speed networking equipment, and RF front-end components used in telecom infrastructure. Serves global OEMs, system integrators, and R&D teams in North America, Europe, and Asia seeking high-reliability, high-layer-count PCB solutions for next-gen communication technologies.
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