Our 34-layer High-Density Interconnect (HDI) printed circuit board is expertly designed for semiconductor test equipment, offering exceptional electrical performance and structural stability. Featuring advanced laser-drilled blind vias of 0.1mm diameter combined with 0.5mm back-drilled holes, this PCB ensures optimal signal integrity. The 1 32 1 layer stacking and 5.0mm thickness deliver minimal warp and twist—only 0.5%, outperforming the IPC-II standard of 0.75%. Manufactured with precision plating and pressing processes using cutting-edge German equipment, it maintains consistent quality even with variable inner copper thickness. Adhering to stringent IPC-III standards, the minimum hole copper thickness of 25 microns guarantees durability without repairs or solder paste use. With a hole diameter of 0.3mm and a length-to-diameter ratio of 17:1, our PCB meets the highest requirements of high-end semiconductor test device manufacturing. This product reflects our company’s commitment to innovation and quality, making it a reliable choice for customers demanding top-tier HDI PCBs.
1. Ultra-precise laser-drilled blind vias at 0.1mm ensure superior signal transmission.
2. 0.5mm back-drilled holes significantly reduce signal reflection and crosstalk.
3. Low warp and twist rate of 0.5% provides enhanced mechanical stability.
4. Compliant with IPC-III standards with minimum 25 micron hole copper thickness for exceptional reliability.
5. Advanced German pressing and plating equipment guarantee unmatched manufacturing quality.
6. Strict PTH process controls with 0.3mm hole diameter and 17:1 length-to-diameter ratio ensure high-end performance.
7. No board repairs or solder paste usage maintain product integrity and longevity.
Ideal for semiconductor test equipment manufacturers, high-frequency testing devices, and advanced electronics requiring multi-layer HDI PCBs with exceptional signal integrity and mechanical precision. Suitable for industries including semiconductor, aerospace, medical electronics, and other sectors demanding reliable, high-precision circuit boards.
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