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Recommended Series
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FLEX PCB(PI, POLYMIDE)
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RIGID PCB(FR-4)
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Company Introduction

Kunshan Ruiheng Electronics Technology Co., Ltd. is a professional manufacturer specializing in the R&D, production, and export of rigid PCBs (FR-4) and flexible PCBs (PI/polyimide). Based in the East China PCB industry cluster, the company is committed to providing global customers with high-reliability, high-precision, and high-consistency circuit board products and customized solutions. With advanced production equipment, a rigorous quality management system, and an experienced engineering team, Ruiheng Electronics can meet diverse needs from small-batch prototyping to medium-to-large-batch production. Its products are exported to many countries and regions in Europe, America, Southeast Asia, and the Middle East, earning a good reputation and long-term cooperative relationships in the international market.
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Hot Products
4-Layer 4oz Heavy Copper PCB for Power Electronics
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Fast Turnaround Double-Layer PCB
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34-Layer HDI PCB with Laser-Drilled Blind Vias and Back-Drilled Holes
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24-Layer High-Frequency PCB with ENIG Surface Finish
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Flexible printed circuit boards (FPC) - single-sided, double-sided and multilayer
https://shmuker.oss-accelerate.aliyuncs.com/data/oss/692910f1af15994642dab58b/692a498eaf15994642dace1b/20251216172341/FR4-PI-Steel-Reinforced-Flexible-Circuit-Board-(FPC)-4.png
Product Services
Ruiheng Electronics focuses on the research and development and manufacturing of rigid PCBs (FR-4) and flexible PCBs (PI), providing rapid prototyping, stable mass production and export delivery services. With reliable quality and professional engineering support, we meet the diverse electronic application needs of global customers.
Recommended Products
4-layer-impedance-controlled-board-3.png
4-Layer 4oz Heavy Copper PCB for Power Electronics
2-layer-PCB-circuit-board-4.png
Fast Turnaround Double-Layer PCB
24-layer-circuit-board-1.png
24-Layer High-Frequency PCB with ENIG Surface Finish
https://shmuker.oss-accelerate.aliyuncs.com/data/oss/692910f1af15994642dab58b/692a498eaf15994642dace1b/20251216172341/FR4-PI-Steel-Reinforced-Flexible-Circuit-Board-(FPC)-4.png
Flexible printed circuit boards (FPC) - single-sided, double-sided and multilayer
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Multilayer FPC Via Design Essentials and Stress Concentration Mitigation in Bend Areas
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In high-density applications like consumer electronics and medical devices, FPC via design and stress concentration in bend regions directly impact product reliability. This article provides an in-depth analysis of via layout optimization techniques, signal integrity assurance strategies, and stress dispersion methods for flexible printed circuits. It illustrates how to avoid common failure risks through practical engineering case studies and demonstrates how our precision manufacturing capabilities, such as 0.2mm minimum via diameter and 0.1mm line width/spacing, support the realization of complex designs, helping you master the core logic of high-density FPC design from principle to mass production.
https://shmuker.oss-accelerate.aliyuncs.com/data/oss/692910f1af15994642dab58b/692a498eaf15994642dace1b/20251216172341/FR4-PI-Steel-Reinforced-Flexible-Circuit-Board-(FPC)-1.png
Double-Layer PCB Rapid Prototyping: Comprehensive Process Flow and Key Technology Analysis
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This article provides an in-depth analysis of the complete manufacturing process for double-layer PCB rapid prototyping, covering design input, etching, lamination, drilling, and critical surface finishing technologies (LF HAL, ENIG, OSP). It elaborates on flying probe testing technology in electrical reliability inspection. By emphasizing the advantages of in-house manufacturing, it demonstrates how to achieve strict quality control and significantly shorten lead times. Incorporating advanced production equipment and efficient logistics solutions, this article serves as a practical technical reference and optimization strategy for electronic engineers, production managers, and procurement decision-makers, aiding in enhancing product development efficiency and supply chain responsiveness.
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Professional High-Speed Multilayer PCB Impedance Control Solutions for Reliable 5G and High-Frequency Communication Module Design
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This article provides an in-depth analysis of impedance control technologies in high-speed multilayer PCB design, highlighting the critical impact of 50-ohm single-ended and 100-ohm differential impedance standards on signal integrity. Through practical case studies of 5G and high-frequency communication modules, it elaborates on the application of high-performance dielectric materials and precision manufacturing processes in stabilizing impedance, minimizing signal reflection, and reducing crosstalk. Advanced impedance measurement and verification techniques are also explored, guiding engineers to enhance product quality through design simulation and rigorous AOI inspection. Tailored for PCB design engineers and telecommunications equipment developers, this content offers professional insights for ensuring the reliability of high-frequency, high-speed communication systems. It subtly recommends competitive high-frequency and high-speed PCB manufacturing solutions to facilitate superior product design and performance assurance.
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